ECAD/MCAD Collaboration Implementor Forum

Task and Objective

Current electro-mechanical designs have many challenges that can significantly increase design effort and the time-to-market. Typically, these challenges are separated into two groups (1) collision and connectivity design challenges and (2) synchronization issues. Component and mechanical clearances must be accounted for in both the electrical and mechanical designs in order to ensure that no physical violations occur when the PCB is placed within the enclosure and/or entire system. Tight synchronization between the electrical and mechanical flows is required to ensure that both designs are correctly aligned for fabrication.

With the introduction of the ProSTEP iViP Incremental Data Exchange (IDX) communication protocol developed by the ECAD/MCAD IF project group, designers are now able to fully synchronize their data between both ECAD and MCAD and more effectively collaborate on critical design items between domains  ensuring that the design intent is interpreted correctly. This allows designers to collaborate and identify issues much more easily throughout the design process, which in turns enables more robust designs that get out to market faster.

Focus and concrete results

Organizational and technical challenges

Im Jahr 2022 hat die Projektgruppe intensiv an der neuen Major-Version IDXv5.0 gearbeitet. Entsprechende Use Cases, die bereits in den Vorjahren definiert worden waren, mussten aufgrund der notwendigen Änderungen am IDX-Modell in einer Major-Version umgesetzt werden. Die Projektgruppe führte die Arbeiten an IDXv5.0 in monatlichen Online-Sitzungen durch, in denen die Teilnehmer ihre Vorschläge für die Umsetzung präsentierten. Die regelmäßigen Treffen mit allen Beteiligten führten zu konstruktiven Diskussionen, die es ermöglichten, stetige Fortschritte zu erzielen und eine Vielzahl von Anwendungsfällen umzusetzen.

Planning for the current year 2023

For 2023, the ECAD MCAD Collaboration IF group will continue to add additional schema changes to support advanced design collaboration and improve the implementation guidelines when implementing the IDX standard. Below is a table of the initial plan of schema and documentation changes for 2023:

IDX Schema Enhancement

Multiple users in same design & Cloud
Board ID (Cloud Support)
Change ID (Cloud Support)
IDX Header Text for file type (copper)
Flex- Fruit Rollup
Flex – Book Binder
Component Layer Property
Simplify IDX Format
Net Name in Copper file (Documentation)
Panelization (Documentation)
IDX Workflow Documentation (Documentation)
Recommended Resolution of Digits (Documentation)
Text in IDX (Documentation)
List all properties used in IDX schema (Documentation)

As well as improving the standard. The ECAD MCAD IF group plans to undertake a benchmark to ensure compliance of the IDX standard for all ECAD and MCAD vendors within the working group. This benchmark will identify the workflow and data transfer between the ECAD PCB design and the MCAD assembly.

Project management

Chair WF, IF, BM:
Alex Grange, Siemens

Project coordination

Brian Watson
E-Mail: brian(at)desktop-eda.com.au

Participants

CadCam Design Centar
Cadence
Dassault Systèmes
DesktopEDA
PROSTEP
PTC
Siemens PLM